Method And Apparatus For Electricity Generation Using Electromagnetic Induction Including Thermal Transfer Between Vortex Flux Generator And Refrigerator Compartment

ABSTRACT

System and method for generating and storing electricity by electromagnetic induction using a magnetic field modulated by the formation, dissipation, and movement of vortices produced by a vortex material such as a type II superconductor and further including a vortex flux generator in cryostat and a refrigerant compartment having bi-directionally thermal transfer to the vortex flux generator are described. Magnetic field modulation occurs at the microscopic level, facilitating the production of high frequency electric power. Generator inductors are manufactured using microelectronic fabrication, in at least one dimension corresponding to the spacing of vortices. The vortex material fabrication method establishes the alignment of vortices and generator coils, permitting the electromagnetic induction of energy from many vortices into many coils simultaneously as a cumulative output of electricity. A thermoelectric cycle is used to convert heat energy into electricity.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is a continuation application of U.S. patentapplication Ser. No. 13/640,683, entitled “Method and Apparatus forElectricity Generation Using Electromagnetic Induction Including ThermalTransfer Between Vortex Flux Generator and Refrigerator Compartment,”which was filed on Feb. 19, 2013, now granted as U.S. Pat. No. ______;which, in turn is a 371 National Phase application of InternationalApplication No. PCT/US2011/031789, entitled “Method and Apparatus forElectricity Generation Using Electromagnetic Induction Including ThermalTransfer Between Vortex Flux Generator and Refrigerator Compartment,”which was filed on Apr. 8, 2011; which in turn claims priority to U.S.Provisional Application No. 61/323,293, filed Apr. 12, 2010, titled“Vortex Flux Refrigerator.” Each of foregoing applications isincorporated by reference herein in its entirety.

TECHNICAL FIELD

The present invention relates to a method and apparatus for energyconversion. More specifically, the invention relates to a method andapparatus for cyclical conversion of an input energy source into thekinetic energy of a magnetic field modulated by vortices, and then intoelectric energy. Further, the disclosure relates to a method andapparatus for generating and storing electricity by electromagneticinduction including a vortex flux generator in cryostat and refrigerantcompartment.

BACKGROUND

The second law of thermodynamics is an expression of the tendency thatover time, differences in temperature, pressure, and chemical potentialequilibrate in an isolated physical system. From the state ofthermodynamic equilibrium, the second law declares the impossibility ofmachines that generate usable energy from the abundant internal energyof nature by processes called perpetual motion of the second kind.

The second law of thermodynamics applies in many specific ways, forexample, in that any system involving measurable heat transfer has someirreversible energy loss to heat. Although there have been manyexperiments to prove exceptions to this general rule, no device yetexists that harnesses thermal energy and converts it into electricitywithout loss.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, identical reference numbers identify similar elementsor acts. The sizes and relative positions of elements in the drawingsare not necessarily drawn to scale. For example, the shapes of variouselements and angles are not drawn to scale, and some of these elementsare arbitrarily enlarged and positioned to improve drawing legibility.Further, the particular shapes of the various elements as drawn are notintended to convey any information regarding the actual shape of theparticular elements, and have been solely selected for ease ofrecognition in the drawings.

FIG. 1 shows a schematic view of a vortex flux generator in accordancewith aspects of the disclosure.

FIG. 2A shows an exploded isometric view of a vortex material chip andthe inductor chip sandwiched together with a mounting substrate inaccordance with aspects of the disclosure.

FIG. 2B shows an isometric view of the vortex material chip and theinductor chip sandwiched together with a mounting substrate from FIG.2A, where the sandwiched chips are mounted to the mounting substrate,and one of the sandwiched chips is concealed inside the recess of themounting substrate in accordance with aspects of the disclosure.

FIG. 3 shows an exploded isometric view of the layered components of aninductor in the vortex flux generator in accordance with aspects of thedisclosure.

FIG. 3A shows an isometric assembled view of the layered components thatan inductor in the vortex flux generator may include, where the layeredcomponents of FIG. 3A are illustrated in a manner that is morerepresentative of how these layered components are actually assembledtogether. Compared to FIG. 3, the components in FIG. 3A are illustratedwith a lesser degree of vertical expansion, and more components arehidden by adjacent components in accordance with aspects of thedisclosure.

FIG. 4 shows a schematic of a helical coil of electrically conductivematter that is analogous to and may be utilized as the inductor in thevortex flux generator in accordance with aspects of the disclosure.

FIG. 5 shows an exploded isometric view of an alignment means used toalign layered components in the vortex flux generator in accordance withaspects of the disclosure.

FIG. 6 shows a schematic illustration of a single inductor disposed neara vortex material, wherein a depicted magnetic field density is notmodulated by a vortex in accordance with aspects of the disclosure.

FIG. 7 shows a schematic illustration identified in FIG. 6, with avortex now present. The vortex is modulating the magnetic flux, andinducing electricity in the inductor in accordance with aspects of thedisclosure.

FIG. 8 shows an isometric view that depicts the magnetic flux beingmodulated by a plurality of vortices, and a plurality of layeredinductors analogous to the inductor of FIG. 3A, that are interconnectedin series, producing electricity in accordance with aspects of thedisclosure.

FIG. 9A shows a plan view of a surface plane of the vortex material,depicting the location where a means has been deployed to urge theformation of vortices at particular positions in accordance with aspectsof the disclosure.

FIG. 9B shows a plan view of a surface plane of the vortex material ofFIG. 9A, depicting vortices that have formed at the urged positions inaccordance with aspects of the disclosure.

FIG. 10 shows a plan view of the plane of an array of inductors that aremanufactured analogous to the inductor of FIG. 3A, in positions thatcorrespond to the urged location of the vortices depicted in FIG. 9B inaccordance with aspects of the disclosure.

FIG. 11 shows a schematic illustration of the vortex flux generatordepicting the elements of the control system, energy source, sink andoutput in accordance with aspects of the disclosure.

FIG. 12 shows a schematic illustration of a single inductor disposedbetween vortex material, wherein a depicted magnetic field density isnot modulated by a vortex in accordance with aspects of the disclosure.

FIG. 13 shows a schematic illustration identified in FIG. 13, with avortex now present in one of the vortex materials. The vortex ismodulating the magnetic flux, and inducing electricity in the inductorin accordance with aspects of the disclosure.

FIG. 14 shows an isometric view that depicts the magnetic flux beingmodulated by a plurality of vortices in accordance with aspects of thedisclosure.

FIG. 15 shows a schematic illustration of the vortex flux refrigeratordepicting the elements of the vortex flux generator, refrigeratedcompartment, control system, energy source, sink and output inaccordance with aspects of the disclosure.

FIG. 16 shows a schematic illustration of the vortex flux refrigeratordepicting the elements of the vortex flux generator, refrigeratedcompartment, control system, energy source, sink and output inaccordance with further aspects of the disclosure.

DETAILED DESCRIPTION

In the following description, certain specific details are set forth inorder to provide a thorough understanding of various embodiments of theinvention. However, one skilled in the relevant art will recognize thatthe invention may be practiced without one or more of these specificdetails, or with other methods, components, materials, etc. In otherinstances, well-known structures associated with electromagneticinduction, vortices or magnetic fields have not been shown or describedin detail to avoid unnecessarily obscuring descriptions of theembodiments of the invention.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with the embodiment is included in at least oneembodiment of the present invention. Thus, the appearances of thephrases “in one embodiment” or “in an embodiment” in various placesthroughout this specification are not necessarily all referring to thesame embodiment. Furthermore, the particular features, structures, orcharacteristics may be combined in any suitable manner in one or moreembodiments. For example, each specific element includes all technicalequivalents that operate in a similar manner to accomplish a similarpurpose. Unless the context requires otherwise, throughout thespecification and claims which follow, the word “comprise” andvariations thereof, such as, “comprises” and “comprising” are to beconstrued in an open, inclusive sense, which is as “including, but notlimited to.”

For purposes of further understanding the disclosure, the followingterms are defined further below:

Electrical conductor: an assemblage of matter that forms a volume ofmaterial with the property of conducting electric current with low lossor no loss.

Diamagnetism: a property of matter where magnetic fields permeate with areduced degree of penetration, or are repelled, defined here to clarifythe definition of vortices used herein.

Vortex (when used, the plural “vortices” is also implied): matterforming a area, located within and/or adjacent to a vortex material,that has the characteristic of reduced diamagnetism within an area,relative to a comparatively increased diamagnetism outside an area. Thearea may include an additional dimension establishing a volume. Thereduced diamagnetism allows a higher magnetic field density within avortex, while the area surrounding the vortex has a relatively lowerdensity of the magnetic field.

Vortices are formed by a set of conditions applied to a vortex material.For example, by placing a vortex material, that may include asuperconductor material, in a magnetic field, and transferring heatenergy out of the material, urging the material into the superconductingstate, vortices form within and/or adjacent to the material. When avortex forms, the magnetic field density inside the vortex increases,and since the field may include a total field in an area in which thatfield is conserved, the magnetic field surrounding the vortex is urgedto decrease, such that the total conserved field, including the fieldinside and outside the vortex, remains the same.

Vortex material: an assemblage of matter within and/or adjacent to whicha vortex can form. The vortex that forms may do so because of conditionscomprised by the properties of the vortex material. An example vortexmaterial is a superconductor material. The vortex material may includean assemblage of various materials that include both superconducting andnon-superconducting materials, such that assemblage will produce avortex. In additional to a material that forms vortices, the othermatter assembled may include materials that have mechanical support,energy flow connections, insulation, and materials that urge anartificial means to predispose the location that a vortex will form.

The vortex material may be re-entrant, meaning that the vortex forms andsubsequently dissipates in the vortex material, without any externalstimulation. The vortex material may be non-re-entrant, meaning thatthat a vortex forms and/or dissipates only upon external stimulation.The vortex material may include materials that exhibit both re-entrantand non-re-entrant behavior. The vortex material may include materialsthat can be stimulated to form and dissipate vortices by a controllerthat transfers energy into and out of the vortex material.

The vortices that form may include predisposed dimensions that aredetermined by the properties of the assemblage of matter that forms thevortex material, and determined by the environmental conditions that thevortex material is operated in. By artificially compelling a pluralityof vortices to form at predetermined locations, other vortices nearbywill also form at predictable locations nearby the vortices specificallycompelled, by virtue of predisposed dimensions of the vortices.

Magnetic field modulation: a change in the density of a magnetic fieldpermeating an area of matter, whereby the change occurs over an intervalof time. For example, the formation and dissipation of a vortex willchange the magnetic field near where the vortex forms and dissipates.This changing magnetic field over time is a kinetic energy, comprised ofa movement of the density of the field, also known as a modulation ofthe magnetic field, since the field density is moving as time elapses.This may be referred to as field modulation, field density change,movement of magnetic flux, or modulation of the field.

Inductor: an electrical conductor formed such that magnetic fieldmodulation nearby the electrical conductor induces an electric currentto flow in the electrical conductor.

The headings provided herein are for convenience only and do notinterpret the scope or meaning of the claimed invention.

Overview

A method and apparatus for the generation of electric power andconversion of energy by using electromagnetic induction of themodulation of a magnetic field provided by vortices in a vortexmaterial. According to aspects of the disclosure, vortex materialsmodulate magnetic flux in a magnetic circuit, in combination withelectromagnetic induction, whereby the modulated magnetic flux producesan electromotive force in electrical conductors that can be used tosupply electrical energy to devices that require an input of electricalenergy.

According to one aspect of the disclosure, the vortex flux generatoremploys the magnetic field from a magnetic circuit, a vortex materialthat is known to produce vortices that modulate the magnetic field, anda plurality of interconnected inductors disposed near the location ofthe vortices, such that the flux modulation of the vortices is convertedinto electricity, and accumulated into electrical conductors.

According to further aspects, a controller provides the conditionsneeded to urge the vortex material to form vortices; the vortices thenmodulate the magnetic field. The controller's function may include ameans or collection of means to transfer energy into and out of thevortex material.

The vortices occur at a microscopic level of existence. In order toaccumulate a non-zero electric power from the microscopic movement ofmagnetic flux urged by the vortices, the inductors are manufactured tomatch the microscopic modulation. Microelectronic manufacturing methodsare used to fabricate inductors that include the correct dimensions,position, and to interconnect them. The electrical power produced iscomprised of an accumulation of the converted energy of a plurality ofvortices that is induced into a plurality of inductors.

The inductors are manufactured with their position and size known inaccordance with the design parameters of the manufacturing process. Thevortex material produces vortices by virtue of the properties of thevortex material. Therefore, by fabricating a vortex material, thevortices may occur.

According to aspects of the disclosure, to facilitate a correspondenceto the location of magnetic flux modulations, the vortices areartificially aligned to the inductors by urging the vortices to form atlocations corresponding to the known location of the inductors.

According to further aspects of the disclosure, the controller transfersenergy that may include energy from a variety of sources into theapparatus, and removes excess energy that is not converted intoelectricity. In this energy transfer process, vortices are formed,dissipated and moved, causing electricity to be generated in theinductors.

According to still further aspects of the disclosure, a vortex fluxrefrigerator is a method and apparatus to refrigerate a compartmentusing a vortex flux generator together with a heat transfer loopcomprised of a heat conduction media and heat exchanger. Heattransferred from the refrigerated compartment is converted toelectricity using micro-coils by the quench cooling action of the vortexmaterial.

According to one embodiment, a vortex flux generator is operably coupledto the vortex flux refrigerator. Alternatively, the vortex fluxgenerator may be contained within the vortex flux refrigerator. Thevortex flux generator includes a method and apparatus that generateselectricity by electromagnetic induction, using a magnetic fieldmodulated by the formation, dissipation, and movement of vorticesproduced by a vortex material such as a type II superconductor. Magneticfield modulation occurs at the microscopic level, facilitating theproduction of high frequency electric power. Generator inductors aremanufactured using microelectronic fabrication and correspond in atleast one dimension to the spacing of vortices. According to aspects ofthe disclosure, the fabrication process establishes the alignment ofvortices and generator coils, permitting the electromagnetic inductionof energy from many vortices into many coils simultaneously as acumulative output of electricity. A thermoelectric cycle is used toconvert heat energy into electricity.

In one embodiment, the disclosure can be practiced minimally by using asingle vortex. According to further embodiments, the invention can bescaled to any size by increasing the quantity of vortices and thequantity of inductors, to comprise a generator suitable to power a broadrange of electric power applications. The energy input may includeenergy from a broad range of energy sources, including renewable energysources such as solar and geothermal.

Vortex Flux Generator

Referring now to FIG. 1, a vortex flux generator 500 combines vortexmaterials with magnetic flux modulation to urge an electric current toflow in an inductor using electromagnetic induction. A magnetic circuitis formed using a magnetic core 27 including magnetic powder oramorphous metal with a 0.7 Tesla magnet, or magnets 21 having apermanent magnet or electromagnet inserted in the circuit, yielding amagnetic field denoted by the illustrative field lines 20. A vortexmaterial 24 and inductor array 22 are placed within the magneticcircuit. As shown in FIG. 1, the vortex material 27 and inductor array22 are adjacent to each other in the magnetic field. The elements of thecomponent labeled “Controller” in FIG. 1 are further detailed withrespect to FIG. 11. Electricity Output 200 represents the power outputof one embodiment of the disclosure.

Referring to FIG. 3, a microscopic inductor is fabricated usingmicroelectronic fabrication. This fabrication process is comprised of alayered microelectronic process analogous to the process currently usedto fabricate CMOS integrated circuit chips. The exemplary expandedinductor shown in FIG. 3 is comprised of five layers of copper alloyelectrical conductors 72, where the trace width and spacing is fiftyfive nanometers. Both the trace height of eighty two nanometers, andinsulator 73 thickness of ten nanometers, are not proportionally scaledto the thickness of the electrically conductive layer in theillustration. An electrically conductive via 74, through the insulator73, interconnects the layers of the inductor. As will be appreciated bythose skilled in the art, any number of layers of conductors and varyingwidths and spacing may be employed within the scope of the disclosure.

An electrical interconnect 71 may include a continuation of the trace ofthe electrical conductor 72. Interconnect 71 may be used to connect toother inductor assemblies. An analogous interconnect, at the bottom-mostconductor layer shown, provides the connection for the opposite end ofthe inductor assembly in FIG. 3.

In the exemplary embodiment, each layer of the electrically conductivematerial is an arced segment that is not closed upon itself. Each layerincludes three-fourths of a turn of an equivalent helical coil. Inalternative aspects of the disclosure, a helical coil fabricated from afifty nanometer diameter wire, depicted in FIG. 4, may be utilized asthe inductor.

In FIG. 3A, the expansion of the view in FIG. 3 is decreased, forming amore uniform illustration. According to aspects of the disclosure, theinductor assembly of FIG. 3A may include similar components as FIG. 3.

According to one embodiment and as further shown in FIG. 8, the inductorassembly 37 is comprised of seven layers of an electrical conductor, andseven layers of insulator, including five and one quarter turns of theconductor that includes the inductor, about its central axis. Theinductor 37 is an extension of the assembly in FIG. 3A, with morelayers, such that the electrical interconnects 36 and trace extension 40for the assembly exit on opposite sides, facilitating interconnection tothe adjacent inductor assembly also shown in FIG. 8, and interconnectedwith trace extension 40. In FIG. 10, fourteen of these layered inductorassemblies 66 are depicted in an array upon a substrate 65. According toaspects of the disclosure, the substrate 65 may be a one millimetersilicon wafer.

Referring to FIG. 6, a single inductor 30 is illustrated. Magnetic fluxlines 32 are shown in the state where no vortex is present in a vortexmaterial 31 resulting in negligible current flowing in the inductor 30.

FIG. 7 shows a vortex 35 formed in vortex material 31 and as shown bythe illustrative magnetic flux lines, the magnetic field indicated isincreasing in density in the vortex 35, and in the adjacent inductor.The increasing magnetic field density is illustrated by 33. While themagnetic field density is increasing in the inductor, electric powerflows from the inductor, indicated by the arrow 34. As described herein,when the vortex dissipates, electric power also flows from the inductor,with the current in the opposite direction, according to Lenz's Law.

FIG. 8 illustrates a placement of inductor assemblies 37 in between thelocation that vortices 39 form from a vortex material 41. Three vorticesare shown. By this placement of the inductors, the magnetic flux densitydecreases in the inductors when the vortices form. This decrease in fluxdensity induces electric power to flow from each of the inductorassemblies. The trace extension 40 connects the two illustrated inductorassemblies shown in series. This connection accumulates the electricpower from the inductors. The interconnect 36 may comprise a connectionto another inductor, or a connection to a load powered by theElectricity Output 200 of the present invention, shown in FIG. 1 andFIG. 11.

Each of the exemplary inductor assemblies has connector terminalsincluding at least two terminals. The interconnecting conductors betweenthem establish an interconnecting means. Every interconnection resultsin a fewer number of conductors emanating from the plurality ofinterconnected inductors so connected. In the exemplary embodiment,millions of inductors may be connected in series, resulting in anaccumulation of the electrical power from millions of inductors into asingle pair of conductors, thereby providing a fewer number ofconductors, by using microelectronic fabrication of an interconnectingmeans of a plurality of interconnected inductors. A million inductorshave at least two million connection terminals, however wheninterconnected, the million inductors have a result that may include twoterminals instead of two million.

Again referring to FIG. 8, during the formation and dissipation of thevortices, the magnetic flux 38 may include an induced electric power inthe inductor by the action of the vortex while the vortex is stationarywith respect to the inductor and vortex material 41. This is by theincreased density of magnetic flux within the vortex as compared to thedensity of the flux surrounding the vortex.

The electric power induced in the inductor may be induced by anelectromagnetic induction comprised of a changing magnetic field withrespect to the inductor by a movement of a vortex respectively to theinductor, where the vortex 39 that carries an increased magnetic fielddensity within it moves with respect to the inductor 37. Although ameans is deployed to have the vortices form at predetermined positions,vortices may move respectively to the vortex material and inductors bythe action of energy in the vortex material. Said energy may include theenergy of the electrical current produced by the Quench Control 600 inFIG. 11.

The electric power induced in the inductor may be induced by anelectromagnetic induction comprised of a changing magnetic field withrespect to the inductor by a displacement of magnetic flux density fromone vortex to another. This occurs by the property of the vortices,where an amount of flux in one vortex may displace to other vortices.Although the total of the flux density in all vortices is conserved, theflux passing through an inductor disposed nearby will change, producingelectricity in the inductors that encompass the changing flux.

FIG. 9A depicts a surface plane of the vortex material. In an exemplaryembodiment, the vortex material 61 includes layers of materialsdeposited on a substrate. According to aspects of the disclosure, thevortex material 61 may either begin with the same substrate as thesubstrate for the inductor array, or utilize its own substrate. If onits own substrate, the substrate used may include a material that has acryogenic contraction rate analogous to the rate of contraction of theinductor substrate, such that the alignment between the vortices andinductors is maintained across the range of operating temperatures.

According to one aspect, when a separate substrate is used, thesubstrate for the vortex material chip and the substrate for theinductor array chip may both include for example, a one millimetersilicon wafer.

When fabricating the layers of the vortex material chip, buffer andinsulator layers are used, and a Bismuth-based Type II superconductorthin film, for example fifty nanometers thin deep, commonly known asBi-2223 is deposited, resulting in a smooth surface that will mate withthe inductor chip's smoothed surface.

FIG. 9A also depicts the locations where a means to urge vortices toform at predetermined positions is deployed. In the illustrativeembodiment shown in FIG. 9A, fourteen such locations 62 are shown. Atlocations 62, the material may have a change in static magneticpermeability, such as by the deposition of a material at these locationswith a different magnetic permeability than the surrounding material,providing a means to urge a gradient in the magnetic field densityresulting in a different magnetic field density, and in particular astatic gradient change in the magnetic field at location 62, creatingformation of a vortex.

Another means to urge vortices to form at predetermined positions mayinclude the actuation of an inductor adjacent to the vortex material, byan electrical current in the inductor, using the inductor as a solenoidelectromagnet, thus comprising a means for a dynamic gradient change inthe magnetic field, whereby the vortex will form at the location 62, asurged by of the solenoid's magnetic field.

Another means to urge vortices to form at predetermined positions mayinclude a means for a change in the uniformity of the vortex material atpredetermined positions. This may include a change in molecularcomposition in the material, such as by the deposition of molecules thatare different from the molecules of vortex material, at thepredetermined positions 62.

Another means to urge vortices to form at predetermined positions mayinclude a change in the crystal lattice structure, comprised of a defector non-uniformity of the lattice at predetermined positions, comprisedof a similar molecular formula as the whole, though with different atomsspecifically at the predetermined positions 62 in the lattice.

Another means to urge vortices to form at predetermined positions mayinclude a change in dimension of the vortex material at predeterminedpositionsined positions, such as a change in the thickness of the layersof substrate, buffer or vortex generating molecular regime, such as isused in the exemplary embodiment described below.

In one exemplary embodiment, an etching process is used to change thedimension of the Bi-2223 thin film at locations 62, to establish thelocations where vortices will form. This change in dimension is effectedby an etching process that is comprised of reducing the depth of theBi-2223 material, for example, by twenty five nanometers in a halfspherical etching cavity that is, for example, twenty five nanometers indiameter, at each location 62.

FIG. 9B illustrates the same vortex material as FIG. 9A, where thevortices 64 have formed.

FIG. 10 is an illustration of the corresponding locations of theinductor assemblies that are comprised of a layered construction methoddetailed in FIG. 3 and FIG. 3A, that are grouped into a matrix, andinterconnected to accumulate the electric power induced into them by themodulated flux from the vortices of FIG. 9B.

In the exemplary embodiment, the inductor array substrate 65 of FIG. 10is assembled adjacent to the vortex material substrate 61 of FIG. 9A, bylayering the two substrates upon each other. The result is that thevortices which form at the predetermined positions within the vortexmaterial, that is layered to the inductor array substrate, are formed atpositions which correspond to the position of the inductors.

In one exemplary embodiment, the predetermined positions place thevortices three hundred and thirty nanometers apart at their centers,alternatively, the vortices may be further apart or closer together ormay be placed at random or irregular intervals. In order to encompass anet changing flux density in the inductors, the length of the segmentsin the inductors may include a length that is approximately half or lessthan the distance between the vortices. This establishes at least onepredetermined dimension that in the exemplary embodiment is one hundredand sixty five nanometers in length, for the segments of the inductors.

The predetermined positions and dimension are illustrated by thecorrespondence of the location of vortices and inductors in FIG. 6, FIG.7, FIG. 8, FIG. 9A, FIG. 9B, and FIG. 10. For illustrative purposes, thefigures shown may comprise a scale that is different from the scale ofthe exemplary embodiment.

Referring to FIG. 2A, in the exemplary embodiment, the inductor array iscomprised of one billion interconnected inductor assemblies on a chip28, with an area of one centimeter square. In FIG. 2A, the substrate ofthe inductor array chip 28 is facing up. The vortex material chip 29, onits own substrate, has its substrate facing down.

These two chips 28 and 29 of FIG. 2A are mounted to each other with thesubstrates facing outward, and the inductors and superconductor filmsseparated by insulation layers comprised of one hundred nanometers totalthickness from all mating surfaces.

In FIG. 2B, the two sandwiched chips from FIG. 2A are installed into thesubstrate, such that the chip 29 of FIG. 2A, now attached to chip 28, isconcealed beneath chip 28 in the illustration of FIG. 2B, inside thesubstrate cavity 230 of FIG. 2A.

Referring to FIG. 5, the two layers 77 and 78 correspond to the twochips 28 and 29 of FIG. 2A, in this particular example. FIG. 5 depictsthe usage of an alignment means to ensure the corresponding placement ofthe vortex locations and inductor locations using perpendicularreferences 75, and alignment marks 76 manufactured into each chip 77 and78, wherein the alignment marks correspond to the placement of theelements of each respective chip to be aligned.

The two layers, 77 and 78, used in this generalized alignment means ofthe FIG. 5 illustration, may also refer to the alignment of individuallayers, rather than specific chips.

The chips aligned and attached to each other using the aforesaidalignment method, are mounted into a substrate 235 with a cavity 230 ofFIG. 2A. The cavity 30 provides a recess into which the chip 29 will becontained after being mounted to chip 28. The result is that the largerchip 28 appears on the top of the substrate 235, and this result isshown in FIG. 2B. This resulting aligned chip sandwich includes thevortex material 24, and inductor array 22, both of FIG. 1, inserted intothe magnetic circuit 27.

The Bismuth based superconductor used as the source of the vortices inthe vortex material chip operates at cryogenic temperatures, as asuperconductor, in the magnetic field of the magnetic circuit. It can bequenched out of the superconducting state by an application ofadditional energy including nuclear energy, electromagnetic energy,thermal energy, modulation of the magnetic field or an electric current.When quenched, the vortices dissipate. These forms of energy may alsocomprise energy that provides the energy converted into electricity bythe present invention. The energy that is the source of the convertedenergy, and the energy that performs the quenching, may include at leastone of these, or a plurality of these.

A Bi-2223 superconductor thin film can be rapidly quenched with a modestelectrical current when a static magnetic field is already present, asin the case of the present invention.

Referring to FIG. 11, in an exemplary embodiment, a quench controlcircuit 600 applies a pulse of electric current to the vortex material.The current used is ten times the nominal half ampere quenching current,applied as a high speed current pulse via Quench Control circuit 600, asa one hundred nanosecond, five ampere quenching pulse. This quenches thevortex material within 500, dissipating vortices. Feedback may beutilized by Quench Control 600 to modulate the quenching pulse, whileutilizing minimal electric energy, such that the net Electricity Output200 is maximized.

Although a vortex material in the present invention may include one thatis a re-entrant vortex material, a non-re-entrant vortex material, and avortex material which is controlled by a means of stimulation nearby thevortex material, in the case of the exemplary embodiment, the controllerof FIG. 1, exploded into detail within FIG. 11, supplies an means ofexternal stimulation, via the pulsed current, to operate the vortexmaterial in a cyclical re-entrant mode.

When the vortex material quenches, heat energy is transferred to theenergy of the increased disorganization of the vortex material. That is,the vortices were more organized, and when the vortices dissipated, thevortex material becomes less organized. Heat energy is used in thevortex material to effect the change in organization. Since the vortexmaterial is not operated adiabatically, instead of its temperaturesimply lowering, heat energy is transferred into the vortex material,whereby the vortex material effectively absorbs heat energy from itsoperating environment, especially through the heat valve 300. The actualaction is that the heat energy transfers from the warmer heat valve 300to the vortex material.

Energy supplied to the present invention may include heat energy by heatsource 100, as modulated by heat valve 300. The present inventionrequires a sufficient flow of energy to provide for the energy needed tobe converted to electricity output 200, plus the energy that is outputat heat sink output 800, plus the energy needed by self conversion topower the quench control 600 and cryogenic pump 700 when switch 95 isnot in the battery 400 position.

After cessation of the quenching current pulse, and absorbing energyfrom the source, the Bi-2223 material, still below its superconductingtemperature threshold Tc, will be in the superconducting state, andvortices are again formed, flux is modulated, and electricity generatedin the inductor array chip within 500. Vortex formation, quenching,vortex dissipation, energy absorption, together with generation ofelectricity by electromagnetic induction from magnetic field modulation,are the cycles of the method of the present invention.

In the process to dissipate vortices by a pulsed electric current in theexemplary embodiment, and transfer heat energy into the vortex material,more than one form of energy was involved in the cycles of the method ofthe present invention, comprised of the energy of an electric current,and heat energy.

With the aforementioned chip construction and magnetic field strength,and operating at a cycle rate of one MHz, the usable Electricity Outputfor the system is ten watts, with an energy input that may include, forexample, 10.1 watts. The system may be scaled upward, and the cycle rateincreased to provide correspondingly higher output capacities.

The vortex flux generator in an exemplary embodiment is used as athermoelectric converter, with an intermediate phase of magnetic fieldmodulation. Energy from the Heat Source 100 is converted intoElectricity Output 200. Heat energy, which may include waste heat, isremoved via the cryogenic pump 700 to the heat sink 800. Heat sink 800represents a cumulative output of all energy dispersed from the heatsource that is not output in any other path. Heat sink 800 may include asink at a lower temperature than heat source 100.

Battery 400 is enabled via switch 95 to start the process, supplyingelectric power to run the cryogenic pump 700, and the quench control600. After the cyclical energy generation operation begins, and the heatenergy source is used as the energy input for the system, switch 95 mayselect that a portion of the electrical output of the generator 500 beused to power the quench control 600 and cryogenic pump 700, rather thanuse the battery.

Vortex Flux Refrigerator

According to further aspects of the disclosure, a vortex fluxrefrigerator is a method and apparatus to refrigerate a compartmentusing a vortex flux generator together with a heat transfer loopincluding a heat conduction media and heat exchanger. Heat transferredfrom the refrigerated compartment is converted to electricity usingmicro-coils by the quench cooling action of the vortex material.

According to one embodiment, the vortex flux generator may be operablycoupled to the vortex flux refrigerator. Alternatively, the vortex fluxgenerator may be contained within the vortex flux refrigerator. Thevortex flux generator includes a method and apparatus that generateselectricity by electromagnetic induction, using a magnetic fieldmodulated by the formation, dissipation, and movement of vorticesproduced by a vortex material such as a type II superconductor. Magneticfield modulation occurs at the microscopic level, facilitating theproduction of high frequency electric power. Generator inductors aremanufactured using microelectronic fabrication and correspond in atleast one dimension to the spacing of vortices. According to aspects ofthe disclosure, the fabrication process establishes the alignment ofvortices and generator coils, permitting the electromagnetic inductionof energy from many vortices into many coils simultaneously as acumulative output of electricity. A thermoelectric cycle is used toconvert heat energy into electricity.

Referring now to FIGS. 12, 13 and 14, FIG. 12 shows a view of amicroscopic assembly which may include magnetic field lines 1230, vortexmaterial 1231 which is one side of a sandwich, vortex material 1234which is the opposite side of the sandwich, inductor 1233 which issandwiched between vortex materials 1231, 1234, electrically conductiveinterconnect 1232 which transports the electric current to and from theinductor, current flowing in a first direction 1335, vortex 1336 formedin vortex material 1234, vortex 1437 formed in vortex material 1231, andcurrent 1438 flowing in a direction opposite the first direction.

The inclusion of opposing vortex materials that actively utilizevortices to both increase and decrease the magnetic field density in theinductor is selected according to particular implementation's designparameters, since the field will return to a state of a different fielddensity within the inductor if both were not included. In more detail,this allows that a vortex material may be disposed that increases thefield density in the inductor, or a vortex material may be disposed thatdecreases the field density in the inductor, or a vortex material may bedisposed that both increases and decreases the field density in thecoil.

Depicted in FIG. 12, no vortex is formed and no current is flowing inthe inductor. In FIG. 13, a formed vortex increases the magnetic fielddensity within the inductor, inducing a current to flow. In FIG. 14, thevortex of FIG. 13 has dissipated and vortices form in the opposite sidevortex material, which decreases the magnetic field density within theinductor, thereby inducing a current to flow in the direction that isthe opposite of the current in the prior FIG. 13.

Diagram FIG. 15 is an illustrative view of the major componentassemblies of the vortex flow refrigerator which includes some titlesand further detail as follows. Bidirectional heat flow 93 transfers heatvia heat conduction media and exchanger out of the refrigeratedcompartment 910, and transfers cooled heat conduction media into therefrigerated compartment 910. Bidirectional heat flow 94 establishes andmaintains the operating temperature range in vortex flux generator 930using cryogenic maintainer 940 and heat sink or source 950. Switch 95provides a means to operate the electric stimulus and power within thevortex flux refrigerator system either from battery 400 or from theelectrical output of the vortex flux generator.

Diagram FIG. 16 is an illustrative view of the major componentassemblies of an alternative vortex flow refrigerator which includessome titles and further detail as follows. For the use herein, ‘thermalenergy,’ includes generally the electromagnetic band known as blackbodyradiation. Non-thermal energy includes all other bands of energy, suchas RF, visible, x-ray, gamma, and the like. According to aspects of thedisclosure, ‘internal engine’ generally refers to where in the systemthat the thermoelectric cycle process takes place. According to furtheraspects of the disclosure, ‘external surface’ of the engine generallyrefers to the outside of the cryostat.

As further shown in FIG. 16, bi-directional liquid nitrogen fluid flow80 transfers heat via heat conduction media and exchanger. The transfermay be by stainless steel tubing or other suitable fluid conduits to anexchanger stage 920 and/or vortex flux generator 930. According toaspects of the embodiment, insulation 81 may be provided between theinternal engine and external engine surface. Insulation 81 may include,for example, an evacuated chamber. A real or virtual delineation 82 maybe provided between the internal engine and the insulation, i.e. innerchamber of the vortex flux generator in cryostat. Bi-direction liquidnitrogen heat exchanger establishes and maintains the operatingtemperature range in fluid flow 83 between vortex flux generator 930using cryogenic maintainer 940. In an alternative embodiment, thecryogenic maintainer 940 might be the same unit as the exchanger stage920. As shown in FIG. 16, energy 84 that is dispersed from the internalengine is comprised primarily of energy that is non-thermal, forexample, RF energy. Thermal or non-thermal energy may be transferred todispersed energy output 960 for storage, further processing, or forimmediate reuse.

As further depicted in FIG. 16, an external surface of engine 85 mayfurther interact with components of the system. For example, theexternal surface may be an RF shield that converts some RF energy tothermal energy which disperses to the dispersed energy output 960.

In a minimal configuration, the vortex flux generator cryostat is itselfthe refrigerated compartment, utilizing the vortex flux generator'sthermoelectric effect, heat exchanger and heat source to maintain theoperating temperature of the vortex flux generator while the electricoutput 200 powers a load. Expanded configurations include additionalheat exchangers and separate or additional refrigerated compartments.

According to aspects of the disclosure, the vortex flux refrigerator iscomprised of a vortex flux generator with vortex material and inductorsfabricated on the same substrate, and vortex materials fabricated suchthey can both increase and decrease the field density in the inductors.

Superconducting heat valves used to regulate the transfer of heat in andout of the vortex flux generator are comprised of a superconductormaterial switched in and out of the superconducting state by temperatureand/or electro-magnetic quenching. The valve is a heat insulator in thesuperconducting state, and conducts heat more rapidly in thenon-superconducting state.

The vortex flux generator operates as a thermoelectric converter usingthe quench induced cooling of the type II superconductor which is usedas the vortex material. An electric output is generated by modulation ofthe magnetic field in the inductors by the vortices. Fabricated etchingis used to change the dimension of the superconductor thin film, toestablish the position where vortices are predisposed to form.

Inductors are fabricated using layered microelectronic fabricationincluding a conductive material. Inductors are aligned with thepredisposed location of vortex formation by the alignment of thefabricated layers upon the substrate.

The refrigerated compartment is also a heated fluid storage tank withina solar heated fluid system. One exemplary fluid is antifreeze, however,other appropriately matched fluids or gases including helium, Freon,water and the like may be used. Refrigeration consists of the transferof heat via the heat conduction media into the vortex flux generatorcryostat, and the transfer of the cooled media back to the heated fluidstorage tank. In effect, the vortex flux generator cryostat and thesolar heat storage tank are both refrigerated compartments from thecooling of the cyclically quenched vortex material.

According to one embodiment, heat conduction media includes nitrogen andantifreeze. As will be appreciated by one skilled in the art, numerousheat conduction media may be used within the scope of the disclosure.Heat exchangers are all of the heat conducting surfaces that are incontact with the heat conducting media, including materials alsocomprised of stainless steel or other metals, ceramics and metal alloysin contact with the heat conducting media.

One method of operation disclosed herein includes a method of operatinga heat engine such that the electromagnetic energy dispersed from theinternal engine traverses a thermal insulator, said thermal insulatorpermits dispersion of non-thermal electromagnetic energy from theinternal engine system to the space outside the internal engine,permitting an operating temperature of the dispersing external surfaceof the engine that is arbitrary when compared to the temperature of theheat source.

The above description of illustrated embodiments, including what isdescribed in the Abstract, is not intended to be exhaustive or to limitthe invention to the precise forms disclosed. Although specificembodiments and examples are described herein for illustrative purposes,various equivalent modifications can be made without departing from thespirit and scope of the invention, as will be recognized by thoseskilled in the relevant art. The teachings provided herein of theinvention can be applied to vortex manipulation in combination withelectricity generation and/or refrigerated compartments and notnecessarily the exemplary combinations generally described above.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet, areincorporated herein by reference, in their entirety. Aspects of theinvention can be modified, if necessary, to employ systems, circuits andconcepts of the various patents, applications and publications toprovide yet further embodiments of the invention.

These and other changes can be made to the invention in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the invention to thespecific embodiments disclosed in the specification and the claims, butshould be construed to include all combinations that operated inaccordance with the claims. Accordingly, the invention is not limited bythe disclosure, but instead its scope is to be determined entirely bythe following claims.

1-26. (canceled).
 27. A vortex flux refrigerator comprising: a vortexflux generator comprising: a magnetic circuit configured to produce amagnetic field, a vortex material, disposed within the magnetic fieldand configured to form and subsequently dissipate a vortex, wherein uponformation of the vortex, a magnetic field density surrounding the vortexis urged to decrease, and wherein upon subsequent dissipation of thevortex, the urging to decrease ceases and the magnetic field densityincreases prior to a reformation of the vortex, wherein the decrease ofthe magnetic field density and the increase of the magnetic fielddensity correspond to a modulation of the magnetic field, and aninductor disposed in a vicinity of the vortex such that the modulationof the magnetic field induces an electrical current in the inductor; anda refrigerated compartment operatively coupled to the vortex fluxgenerator, the refrigerated compartment comprising a heat transfer loopincluding a heat conduction media and a heat exchanger.
 28. The vortexflux refrigerator of claim 27, wherein the vortex material is configuredto form and subsequently dissipate a plurality of vortices, wherein theinductor comprises a plurality of inductors, wherein each of theplurality of inductors is disposed in a vicinity of one of the pluralityof vortices.
 29. The vortex flux refrigerator of claim 28, furthercomprising a plurality of interconnects configured to electricallycouple the plurality of inductors and accumulate the electrical currentsinduced therein.
 30. The vortex flux refrigerator of claim 29, whereineach of the plurality of inductors has at least one predetermineddimension such that the electrical currents accumulated via theplurality of interconnects have a magnitude greater than zero.
 31. Thevortex flux refrigerator of claim 27, wherein the vortex materialcomprises a superconducting material.
 32. The vortex flux refrigeratorof claim 27, wherein the inductor comprises a microelectronicallyfabricated inductor.
 33. The vortex flux refrigerator of claim 27,further comprising a controller configured to control the formation andthe dissipation of the vortex in the vortex material.
 34. The vortexflux refrigerator of claim 33, wherein the controller comprises acontroller configured to control a transfer of energy into and out ofthe vortex material.
 35. The vortex flux refrigerator of claim 34,wherein the energy comprises at least one selected from a groupcomprising: thermal conduction, electrical current, electromagneticenergy, nuclear energy, and magnetic field modulation energy.
 36. Thevortex flux refrigerator of claim 28, wherein the vortex material isconfigured to form and subsequently dissipate the plurality of vorticesat respective predetermined positions within the vortex material. 37.The vortex flux refrigerator of claim 36, wherein the vortex material isconfigured to form and subsequently dissipate the plurality of vorticesat respective predetermined positions within the vortex material withinthe vicinity of a corresponding inductor.
 38. The vortex fluxrefrigerator of claim 36, wherein the vortex material is configured toform and subsequently dissipate the plurality of vortices at positionswithin the vortex material having a gradient in the magnetic fielddensity or a change in the uniformity of the vortex material.
 39. Thevortex flux refrigerator of claim 38, wherein the gradient in themagnetic field density comprises a static gradient change or a dynamicgradient change.
 40. The vortex flux refrigerator of claim 38, whereinthe change in the uniformity of the vortex material comprises a changein the dimension of the vortex material, a change in a molecularcomposition of the vortex material, or a change in a crystal latticestructure of the vortex material.